Programme Details

Keynote: Small Form-Factor-Boards - Overview and Technical Trends

Session 1 - Intel´s Technology and Technical Trends Outlook

Workshop 1 -
Presentations and Demos of x86-based Modules and SBCs

Workshop 2 -
Thermal connection of ESMexpress/ESMini to a housing

Session 2 - Computer-on-Module: Form Factors, Applications, Future Trends

Workshop 3 -
CoreExpress - the next generation, Computer-On- Module Technology

Paper A
Real-time Application Development for Qseven in Industrial Automation

Paper B
Atom-based stand-alone SBC for wireless and net centric multimedia

Optimize Your Design Cycles by Using COM Technology

Development Kits for Atom-based smartCore Integrations

How to get independent from a specific microcontroller

Session 3 - Single Board Computer: Overview and Trends

Conception of various COMs and SBCs with latest Intel processors

Workshop 6 -
Live demo of the Qseven Mobility Starter Kit

Session 4 - Make or Buy

Small Form-Factor Boards - Overview and Technical Trends

presented by Hermann Strass, Technical Consultant
Small Form-Factor Board formats proliferate with the introduction of smaller chips which use significantly less power. Many of these are functional variants of PCs using Intel architecture. This keynote will give an overview about the major technical trends and the most important form factors. The firm factors will be grouped according to application classes and environmental requirements.    

11:00 - 12:00

Intel´s Technology and Technical Trends Outlook

This session is providing an overview of product development and examples of extended technologies and their use in the Embedded market - silicon level developments provided by Intel® in its latest products such as Intel® Active Management Technology™ (Intel® AMT) and Intel® Virtualization Technology (Intel® VT), covering case study examples and demonstrating how you can benefit from using these new technologies in your Embedded applications today.

12:00 - 12:20

Embedded Real-Time Virtualization and Partitioning

The presentation will outline different virtualization technologies and advantages of Intel VT for embedded solutions. The application, benefits and differences of virtualization and partitioning of Intel hardware will also be one of the topics.

Computer-on-Module: Form Factors, Applications, Future Trends

This session is divided into two panels. In the first part the Computer-on-Module Form Factors COM Express, ETX, XTX and ESMexpress are introduced, followed by a short panel discussion with the most important vendors. In the second part the "ultra" Computer-on-Module Form Factors Qseven, nanoETXexpress, CoreExpress and ESMini are introduced, followed by a short panel discussion with the most important vendors.

13:20 - 14:05

Computer-on-Module Form Factors

COM Express is the leading standard in the COM market. It is designed to merge high performance computing and all state of the art interfaces and features of modern PC technology.
ETX is the first and until now the most successful de-facto standard for PCI and ISA based COM with broad industry support. ETX Computer-on-Modules (95 x 125 mm) are the perfect solution for embedded applications that require legacy interfaces. ISA and PCI based, they support x86 processors currently ranging from 500 MHz up to Intel Core2 Duo. They offer a full complement of common PC interfaces such as keyboard and mouse, serial (RS232) and parallel ports as well as Parallel ATA interfaces. The full-featured ETX series also includes onboard USB, Ethernet, graphics and sound. ETX 3.0 compliant COMs additionally provide on-board SATA and USB 2.0. ETX modules are installed on the application specific carrier board, much like an integrated circuit component, in a host site comprised of four low profile surface mount connectors.
XTX is an enhanced version of ETX. It extends the ETX standard with PCI Express, SATA, High Definition Audio, etc, thereby allowing embedded computer modules created using the ETX standard to remain state of the art. The connectors, the geometry, the mechanics, the heat dissipation via the thermal interface and most of the pinout remain unchanged. With the XTX enhancements, ETX designs can be upgraded with the most up-to-date technology.
ESMexpress is currently being standardized as ANSI-VITA 59 (RSE Rugged System-On-Module Express). This type of COM was designed for harsh environmental conditions and safety-critical applications without any compromises. ESMexpress is processor-independent, and its 95x125mm size offers enough space for Intel Atom or PowerPC up to an Intel Core 2 Duo/GS45 platform. It exclusively supports modern serial connections and has a fixed pin assignment without exceptions. Its fanless cooling concept is prepared for a power dissipation of up to 35 W and uses conduction cooling to divert the heat. The PCB is mounted into a frame and completely enclosed in an aluminum housing. At the same time this ensures 100% EMC protection for the electronic parts.

14:05 - 14:50

"Ultra COM" Form Factors Overview:

The Qseven Computer-On-Module standard was developed with an eye on the latest low power processor technology such as the Intel Atom processor and demand for small physical size. With a typical power consumption of < 5 Watts, mechanical dimensions which are scarcely bigger than a credit card, integrated battery management and ACPI 3.0 power management functions, the Qseven Computer-On-Module standard is ideal for all mobile applications.
nanoETXexpress is the standard which elevates Computer-on-Modules onto a level ready for the new generation of ultra mini computers for which the market is seeing great demand at the moment. It boasts an extremely small form factor for a perfect fit in credit card-sized PCs, which run on the new high performance 45nm processors like the Intel Atom series. With its dimensions of 55 x 84 mm it takes up much less space than the PICMG COM Express standard basic (95 x 125 mm), but offers, however, seamless compatibility to it.
The CoreExpress specification was released at the Embedded World 2008 as the smallest COM module form factor with the lowest power consumption, especially designed for rugged mobile applications. CoreExpress is a processor independent specification with a pure digital, rich high speed interface set. CoreExpress is the first specification, which integrates the CAN bus. LiPPERT’s commitment for long term availability (10 years +) saves customer investments.
ESMini employs exactly the same conductive cooling concept as ESMexpress, but with its 95x55mm it is considerably smaller. This COM type is especially suited for smaller CPUs such as Intel Atom or different PowerPCs. In addition to the serial interfaces of each processor or chipset, ESMini also supports the signals from the onboard FPGA. This allows high flexibility in expanding the COM functions by application-specific I/O (UARTs, fieldbuses etc.).

Session 3

Single Board Computers: Form Factors, Applications & Technical Trends

15:15 - 15:35

Single Board Computers in the Course of Time

presented by Peter Lippert, CEO Lippert Embedded Computers
SBC’s are very well accepted and used in different embedded application areas over many years. Through the years they have been reduced in size and power consumption, but they have grown in functionality and performance.The presentation is supposed to show the advantages and disadvantages of the different formfactors like PC/104, ITX and COMs.

15:35 - 15:55

PCI/104express - a life expectancy for the PC/104 form factor

presented by Felix Kunz, CEO with DIGITAL-LOGIC
The PC/104plus standard, in production series up to 1000 pcs./year, has established itself, particularly in military applications, measurement and control technology, and display systems (POI). In 2008 the PCIexpress signals were standardized in the PCI/104express definition. This allows up to 4 PCI/104express peripheral boards to be plugged onto a PCI/104express and optionally an x16-PCI graphics card, which allows the utilization of all currently available high-performance peripheral chips. The PCI/104express standard creates for the PC/104 form factor a life expectancy for the next 10-20 years (it’s already laid-out for the PCIex-5Gbit/s) and is therefore among the longest available computer board standards ever in computer history.

15:55 - 16:15

From Mini-ITX motherboard via Nano-ITX to Pico-ITX SBC

presented by Daniel Piper, Team Leader Product Marketing with Kontron
The success story of the longlife embedded formfactors continues: The latest ultra small SBC formfactor Pico-ITX defined by the SFF-SIG in combination with Intel® Atom™ Z510 / Z530 processor and the Intel® System Controller Hub US15W opens the path for a wide range of miniaturized ultra mobile and multimedia applications, cause its ideal for small and powerful devices.

Session 4

Make or Buy

presented by Stephan Krug, XKrug
This session about "Make or Buy" provides a brief overview how to design Computer-on-Module Concepts. In order to reduce design risks the base idea of the customized Module-Carrier Solution will be derived from vendor Starter Kits. Beside the Hardware Interfaces the Software Support incl. BIOS are well tested and supported for the most important Operating Systems. Tailor-made Carriers could be released within 3-5 month and variants of it allow a huge product range at a competive-pricing and minimized engineering effort.

Workshop 1

Presentations and Demos of x86-based Modules and SBCs
presented by Eurotech
This workshop aims at showing how hardware can be exciting again. Eurotech presents some of its latest x86 architecture modules and single board computers (SBC) with live demos: Catalyst Module, Catalyst Module XL, Catalyst EC and ISIS based on Atom processor. These modules integrate performance and power efficiency in a versatile, compact and rugged form factor that cuts time to market and development costs.COM Express modules based on Core Duo/Core2 Duo and Tolapai processors, which deliver exceptional power and flexibility in a standard form factor and expand the range of opportunities with an efficient design.

Workshop 2

Thermal connection of ESMexpress/ESMini to a housing
presented by MEN
Using the example of a railway-compliant display computer MEN shows how the requirements for the cooling of modern PC architectures which have risen enormously over the last years can be met inexpensively and effectively. Doing this, it is particularly important to detect the hot spots and expertly transfer their dissipated heat to the environment via a heat sink with appropriate dimensions.

This Workshop introduces CoreExpress, a smallest size COM for ruggedized and mobile applications. Difference to existing COM solutions are explained, as well as Condition Monitoring, OS booting from SD-Card and Design-In recommendations. Evaluation Kits and BSPs for Windows XP, Windows CE, Linux and QNX and sample applications. will be explained.

Workshop 4

Optimize Your Design Cycles by Using COM Technology
presented by Advantech
COM Solutions will speed up Time-to-Market a lot and will reduce the risk of new designs. Customer will focus on his core knowledge such as Software and application. But how to keep knowledge in x86 technology and design and how to organize the integration. COM Design-in-Services is the key to succeed in COM Designs.

In this Workshop Kontron will demonstrate and discuss

- a QNX fastboot solution which achieves boot times less than 1 second on a Kontron nanoETXexpress-SP module based on Intel Atom Z5xx processor. The QNX fastboot solution is suitable for all applications those which ask for fastest switch-on times or a long battery life span presupposes.

- a microETXexpress-PC module with 45 nm Intel Core2 Duo (Penryn/Cantiga) chip set. This means highest performance on smallest COM Express compatible form factor

- a pITX single board computer which is likewise equipped with the Intel Atom Z5xx and forms a very compact Multimedia system with various display solutions.

Demonstration of the complete rapid prototyping package for battery-powered, Intel(R) Atom(tm) processor based embedded systems. This kit contains all components - including battery and touch display - required to build rapid prototype for mobile applications.

Paper A

Real-time Application Development for Qseven in Industrial Automation
presented by MSC
The presentation provides an overview on the use of Qseven modules for industrial control and visualization tasks. The development environment Hpe_IRP integrates HW/SW and Tools to realize applications quickly and efficiently. The introduction to the Qseven standard is complemented with FPGA design tools and a live demonstration of a motion control application.

Paper B

The presentation provides an overview on the PROTEUS, based on Atom processor and featuring advanced capabilities, such as: GPS, Bluetooth and ZigBee communications, PCI-Express mini card support, 3D graphics. This stand-alone SBC aim at wireless, net centric multimedia applications, especially in situations where low power and high performance are required, like intelligent transportation, digital signage, remote monitoring, medical diagnostic, telecom and datacom applications.

Paper C

Development Kits for Atom-based smartCore Integrations
presented by Digital-Logic
Digital-Logic provides two Atom-based platforms (PCI/104 and MID) for system integrators. One is the PCI/104 computer board MSM200XP, containing the smartCore including Atom Z5x0, chipset and memories, all interfaces (USB, SATA, LAN, COM, VGA, KB/MS), the expansion busses (PCIe, PCI, LPC, ISA), supplied with 5V only. Second the MID-board, containing additional the 13.2V-LiIon Battery and charger, the LCD with touchscreen, PCIe MiniCard-Slots to add GSM, WLAN, GPS. The MID-board is consumption optimized and uses and integrated passive cooling concept. All development kits include schematics, BOM, integrators-manual, source code and support.

Paper D

How to get independent from a specific microcontroller
presented by PHYTEC
Embedded designs have to resolve specific task. Furthermore, such designs are frequently made for a lifecycle of 10 years and more. Additional requirement from the market have to be fulfilled during the product's lifetime, computing power has to adapted to the current state of art and possible discontinuations of components have to be considered. PHYTEC outlines in this presentation an easy approach to cover all constraints, mentioned above.

Coffee Break

Wrap-up and Prize Draw